Sony has made a few changes to the core hardware of the PS3 that should hopefully get them closer to the hardware break even point.
The Reality Synthesizer (RSX) Graphics Processing Unit (GPU) has seen some changes during the PS3 life-cycle. Initially it was 90nm during launch, later it was reduced to 65nm, and now another change to 40nm. Reducing the chipset is not only inline with industry reductions of larger chips, but it also serves to reduce power consumption and heat which is crucial in a relatively tight space. To date the PS3 Slim units have not experienced the YLOD (yellow light of death) in mass quantities, and this revision should help to reduce that phenomenon.
This new version CECH-2100A contains a few other changes as well. The power supply weighs less, the heatsink is more simple,the internal cooling unit is much smaller as well resulting in an overall lighter console. Further the XD DRAM configuration was changed from being 4×512Mb to 2×1Gb. This is very similar to the future layout that Goto-san described back in 2006.
PocketNews performed the tear down and examination of the system. They also took a look at power consumption and how it relates to the new version:
Model Name
CECH-2000A
CECH-2100A
XMB Menu (Still wallpapers)
76W
67W
XMB Menu (Main Theme)
83-86W
71W
Top Menu torne
92-93W
76-77W
torne program recording and viewing
84-87W
73W
FFXIII Cut Scene
96-107W
78-83W
FFXIII Game Menu
83-84W
74W
BD playback
88-91W
77-78W
Power Off – Remote Play Standby
9W
9W
While it’s not currently available in the US yet, Amazon.co.jp has it available. Lower power consumption, less heat and cheaper manufacturing costs is a win for everyone.
Question
Christopher
Sony has made a few changes to the core hardware of the PS3 that should hopefully get them closer to the hardware break even point.
The Reality Synthesizer (RSX) Graphics Processing Unit (GPU) has seen some changes during the PS3 life-cycle. Initially it was 90nm during launch, later it was reduced to 65nm, and now another change to 40nm. Reducing the chipset is not only inline with industry reductions of larger chips, but it also serves to reduce power consumption and heat which is crucial in a relatively tight space. To date the PS3 Slim units have not experienced the YLOD (yellow light of death) in mass quantities, and this revision should help to reduce that phenomenon.
This new version CECH-2100A contains a few other changes as well. The power supply weighs less, the heatsink is more simple,the internal cooling unit is much smaller as well resulting in an overall lighter console. Further the XD DRAM configuration was changed from being 4×512Mb to 2×1Gb. This is very similar to the future layout that Goto-san described back in 2006.
PocketNews performed the tear down and examination of the system. They also took a look at power consumption and how it relates to the new version:
While it’s not currently available in the US yet, Amazon.co.jp has it available. Lower power consumption, less heat and cheaper manufacturing costs is a win for everyone.
Images courtesy of PocketNews
View the full article
Link to comment
Share on other sites
0 answers to this question
Recommended Posts
Join the conversation
You can post now and register later. If you have an account, sign in now to post with your account.